News

The Chosun Ilbo on MSN3h
Samsung secures AMD contract for HBM3E 12-stack, clears defect concerns
Samsung Electronics has secured a key supply deal with AMD, with its fifth-generation 12-layer HBM3E memory selected for the chipmaker’s upcoming MI350 AI accelerators. The move marks a breakthrough ...
DIGITIMES8h
SK Hynix unveils 30-Year DRAM roadmap with Vertical Gate, 3D stack in bid to extend Moore's Law
SK Hynix has unveiled a long-term roadmap for next-generation DRAM technologies, laying out a vision that aims to drive ...
Korea JoongAng Daily on MSN1d
HBM will top GPU in determining AI performance, says leading Korean semiconductor researcher
High bandwidth memory (HBM) rather than graphics processor unit (GPU) will become the key factor determining AI performance, ...
Network World1d
Micron joins HBM4 race with 36GB 12-high stack, eyes AI and data center dominance
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for ...