Die cracking, solder joint fatigue, warpage, and delamination are just a few of the possible mechanical failures.

Addressing stress-related issues early in the design cycle through a process of chip-package co-design and co-optimization.

This important study provides evidence for asymptomatic Bordetella pertussis carriage among mothers in a longitudinal cohort in Zambia, significantly advancing understanding of transmission dynamics.

A battle over plastic—a material so prolific the UN calls the 90 percent of it that ends up as trash a pollution crisis—is under way in Florida. Coral Gables, a small city of 51,000 people ...

Abstract: Hardware in High Performance Computing environments in recent years have increasingly become more heterogeneous in order to improve computational performance. An additional aspect of such ...

This project demonstrates the application of parallel computing techniques to traditional pathfinding algorithms. The application visualizes the maze solving process and shows performance improvements ...

Abstract: We report on our experience of integrating Fault-Tolerant Parallel and Distributed Computing (FTPDC) concepts in three core and elective courses in spring 2014 at Michigan Technological ...

EVG MLE Technology Advantages LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital ...