Yahoo1mon
Intel has processed 30,000 wafers with High-NA EUV chipmaking tool
The company uses these systems for research and development purposes, and so far, Intel has processed tens of thousands of wafers using them. Intel installed and started using two High-NA EUV ...
C&EN1mon
Surface-Enhanced Raman Spectroscopy for Biomedical Applications: Recent Advances and Future Challenges
Sixth People’s Hospital, School of Medicine & School of Biomedical Engineering, Shanghai Jiao Tong University, Shanghai 200030, P. R. China Centre for Personalized Nanomedicine, Australian Institute ...
C&EN1mon
Enhanced Nitrogen Dioxide Detection Using Resistive Graphene-Based Electronic Sensors Modified with Polymers of Intrinsic Microporosity
Centre for Integrative Semiconductor Materials (CISM), Faculty of Science and Engineering, Swansea University─Bay Campus, Fabian Way, Swansea SA1 8EN, U.K. Centre for Integrative Semiconductor ...
Frontiers1y
Fabrication and quantum sensing of spin defects in silicon carbide
In the past decade, color centers in silicon carbide (SiC) have emerged as promising platforms for various quantum information technologies. There are three main types of color centers in SiC: silicon ...
Frontiers5y
Recent Progress in Waveguide-Integrated Graphene Photonic Devices for Sensing and Communication Applications
Third, the fabrication process needs to be improved to meet the criteria for wafer process lines. Currently, most reported results are laboratory research using the lift-off method to fabricate metal ...
Semiconductor Engineering7y
DSA Re-Enters Litho Picture
This DSA process has some issues, as unwanted residue tends to disperse on the wafer. So in response, Leti and its partners have qualified a new, third-generation PS-b-PMMA material set. The group has ...