The QFN package is a near chip scale package plastic encapsulated package with a coppery leadframe substrate. The purpose of this paper was to establish the wideband equivalent circuit model of QFN ...

The MicroProfile Working Group, the open forum that optimizes Enterprise Java for a microservice architecture, just released their latest iteration, MicroProfile 7.1.

The Eclipse Foundation's Jakarta EE Working Group releases Jakarta EE 11, the latest version of its enterprise Java platform.