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IEEE3d
Characterization and Design of Through-Silicon Via Arrays in Three-Dimensional ICs Based on Thermomechanical Modeling - IEEE Xplore
A general approach has been proposed for predicting the temperature and thermal stress fields of through-silicon-via (TSV) arrays in 3-D integrated circuits (ICs) based on a coupled-field ...
IEEE10d
Designing Large-Element-Spacing Arrays for Diverse Modular Subarrays Through Iterative Convex Relaxation Optimization - IEEE Xplore
This paper introduces a novel modular subarray design method that employs large-element-spacing modular subarrays. By strategically designing the structure and placement of the basic modular units, ...
PBS21d
WATCH: Trump’s military parade honoring Army’s 250th birthday rolls through DC - PBS
WATCH: Trump’s military parade honoring Army’s 250th birthday rolls through DC Politics Updated on Jun 14, 2025 9:10 PM EDT — Published on Jun 14, 2025 2:31 PM EDT ...
C&EN24d
Single-Cell Multiomic MALDI-MSI Analysis of Lipids and N-Glycans through Affinity Array Capture | Analytical Chemistry - ACS Publications
This study presents a novel approach utilizing matrix-assisted laser desorption/ionization mass spectrometry imaging (MALDI-MSI) for rapid single-cell analysis, enabling multiomic data acquisition ...