E&R (E&R Engineering Corp.), a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, has supplied over 500 advanced semiconductor packaging tools to major OSATs worldwide, ...

Amkor Technology, Inc. (NASDAQ:AMKR – Get Free Report)’s share price hit a new 52-week low on Tuesday after B. Riley lowered their price target on the stock from $38.00 to $32.00. B. Riley currently ...

flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking ...

YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With ...

The top level of metalization is then used to connect the I/O circuitry itself to the flip chip pads. The pads are, in turn, connected to the package through a solder ball in much the same way that a ...

While the margin decline stands out, it is encouraging that sales of multilayer ceramic capacitors for automobiles and flip-chip ball grid array, or FC-BGA, packages for servers increased ...

Research Institute Lee Chang-min noted, "The continued strong demand for multilayer ceramic capacitors (MLCC) and flip-chip ball grid arrays (FC-BGA ... of MLCC and packaging substrates." ...