Oct. 07, 2021, Oct. 07, 2021 – . Industry’s first comprehensive 3D-IC platform for multi-chiplet design and advanced packaging. SAN JOSE, Calif., 06 Oct 2021-- Cadence Design Systems, Inc. (Nasdaq: ...

GENIO™ remains the only integrated-from-the-ground up chiplet-packaging Co-design EDA tool and the two new functions increases its ability to meet 2.5D and 3D advanced packaging design challenges.

Together, Ansys and TSMC facilitate optimized 3D integrated circuit (3D-IC) design and accelerate market readiness for AI and high-performance computing (HPC) chip applications. Ansys and TSMC are ...

Tencent has unveiled “Hunyuan3D 2.0,” an AI system that turns single images or text descriptions into detailed 3D models within seconds.The system makes a typically lengthy process — one ...

A team has made a major breakthrough in the field of three-dimensional (3D) imaging of large-scale biological tissues. They ...

On the design side, solutions like NetFabb and Nastran make it easy for engineers to understand the constraints of 3D printing and optimize designs for the process. On the manufacturing side, ...