Uncover the significance of supercomputing and AI in developing next-gen aircrafts that can combat turbulent airflow.

Topological materials are a class of materials that exhibit unique electronic properties at their boundary (surface in 3D ...

Physicists at Bielefeld University and the Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden) ...

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

The findings suggest that sufficiently small particles introduced into the laboratory vortex should behave similarly to dust ...