Abstract: Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite ... thermal stress ...

† State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing, 210096, P. R. China ‡ Department of Physics, Southeast University, ...

In this paper, we relax the above constraint by constructing a system utilizing multiple circular microphone and loudspeaker arrays and designing a corresponding ANC algorithm. By simulation, we show ...