System-in-package-on-module-on-kit. Adding another level of integration, the module is available pre-soldered to an evaluation kit (ATSAMA5D27-SOM1-EK1), making it a system-in-package-on-module-on-PCB ...

Variscite, a leading worldwide System on Module (SoM) designer, developer and manufacturer, will showcase live demos of its latest SoMs at Embedded World 2025, held March 11-13 in Nuremberg ...

VIA today announced the two new VIA modules: the VIA COMe-8X92 the VIA QSM-8Q90. VIA COMe-8X92 Measuring 95mm x 95mm, the VIA COMe-8X92 is based COM. We've just launched our NEW website design!

SECO released its first SMARC system-on-modules based on Qualcomm QCS6490 and QCS5430 application processors. ... PowerPAK 8x8SW Package Promotes Cool-Running, Low-Loss 80-V MOSFETs.

--Mercury Systems, Inc., a technology company that delivers mission-critical processing power to the edge, today introduced a Direct RF system-on-module that uses Intel Agilex FPGAs to detect and ...

Chiplet technology, used in multi-chip modules with the ODSA open source switch fabric could lead to new generations of advanced computational storage devices for enterprise, data center and edge ...

5G mmWave phones are different. In Apple’s iPhone 12, for example, the system consists of several components — a modem, an intermediate-frequency IC, an RF front-end module, two antenna arrays, and an ...

System In Package This cross section of a SiP shows a microprocessor (µP), SRAM and flash memory chips packaged together in the same housing. The L,R,C stands for inductor, resistor, capacitor ...