Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, ...

A new technical paper titled “Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process” was published by researchers at KTH Royal ...

As electronic devices become more advanced, integrating complex logic into a single component becomes essential. Enter AND6, ...

This letter reports the bias temperature instabilities (BTI) of 4H-SiC CMOS devices with different gate lengths (L) and gate widths (W) for integrated circuits at 400 °C for the first time. The result ...

Switched Capacitor (SC) techniques have grown to be the de facto standard for implementation of blended signal blocks in modern CMOS VLSI. The performance regarding switched capacitor circuits ...