In today's increasingly interconnected world, cybersecurity has become a critical concern, especially for hardware and ...

The candidate pool for engineered materials that can help enable tomorrow's cutting-edge optical technologies—such as lasers, ...

First, the company’s Innovator3D IC suite enables chip designers to efficiently author, simulate, and manage heterogeneously ...

Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration” was published by researchers at Yokohama National University, ...