The Chinese Academy of Sciences (CAS) has introduced an AI-driven chip design system named "Qimeng" ("Enlightenment"), signaling a major move in China's drive to accelerate semiconductor ...

Chinese Academy of Sciences recently introduced “Qi Meng,” the world’s first fully automated AI-based processor chip design system. The system enables end-to-end automation from chip hardware to ...

Chinese researchers have released the world’s first fully automated processor chip design system based on artificial intelligence (AI) technology, making AI-designed chips a reality. With its ...

The earlier the SiP-design experts engage with the system designers, the better the resulting design quality is likely to be.

Google's new generative AI video tool Flow and its latest model Veo 3 has advanced features and was designed with the input of filmmakers.

The “pure-play” foundry model, pioneered by TSMC, allows companies to focus entirely on chip design without the prohibitively high cost and complexity of building and operating their own ...

During the last years, the growing application complexity, design, and mask costs have compelled embedded system designers to increasingly consider partially reconfigurable application-specific ...

In 2019, AMD started a new paradigm in processor design, with its Zen 2 architecture and the use of chiplets. Since then, every CCD or Core Complex Die has been home to eight cores—no more, no ...

It's time to dig inside to understand how the internal CPU components are designed. We'll discuss transistors, logic gates, power and clock delivery, design synthesis, and verification.

We have developed a vector coprocessor for a wireless baseband SoC for mobile devices using processor description language. The design of the vector coprocessor is highly-complex and it requires a lot ...

Qualcomm has reportedly been eyeing Intel’s design operations units, particularly its client PC design business — what could this mean for the market, and x86 versus ARM chips?

Modern die-level thermal analysis tools are equipped with capabilities to handle the complexity of 3D IC designs and provide accurate and fast thermal analysis throughout the design flow.