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Ball Grid Array,Dangerous Areas,Diagonal Line,Fatigue Loading,Important Phenomenon,Joint Area,Joint Failure,Kinds Of Samples,Lattice Parameters,Micrographs,Obvious ...
A common packaging type, like the Ball Grid Array (BGA), encapsulates the die with molding compound and uses wire bonds to connect the die to a substrate, enabling integration with PCBs. In devices ...
without the need for BGA (Ball Grid Array) terminals or flexible cables. This technology enables to reduce the electrical signal loss between circuit elements by approximately half (5dB at 130GHz) ...
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