The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 ...

It is designed to significantly reduce overall system power consumption and to allow use of a high-density 17mm x 17mm Flip-Chip Plastic Ball Grid Array (FC-PBGA) package. One of the unique features ...

This study investigates the reliability of solder joints in Ball Grid Array (BGA) packages by examining their dynamic response under board-level drop impacts using Finite Element methods. Explicit ...

DDR4 ball grid array package develops partial connection defect during device operation. Electrical model of defect is presented and Ansys software is used to extract resistance, inductance and ...

Research Institute Lee Chang-min noted, "The continued strong demand for multilayer ceramic capacitors (MLCC) and flip-chip ball grid arrays (FC-BGA) centered around artificial intelligence (AI ...

It excels at inspecting surface mount technology (SMT) components. Still, it faces challenges with solder joints hidden under packages like ball grid arrays (BGAs) or components on densely packed ...