SINGAPORE — ST Assembly Test Services Ltd. this week announced availability of a thinner version of its small-thin plastic ball-grid array (STPBGA) package, which reduces the height to 1.2 mm compared ...

The plastic ball-grid-array (PBGA) package can have up to 976 connections! 2. Here are some of the package options available for a single-function device. (Source: TI PDF: Packaging Solutions) ...

The Ball Grid Array (BGA) Packaging Market delves into various aspects, enabling readers to gain a deep understanding of the market dynamics, trends and potential opportunities. Report Ocean, a ...

White Electronic Designs announced a 2Gb DDR SDRAM, organized as 32M x 64, packaged in a 25 x 25mm, 625mm2, 219 plastic ball grid array (PBGA) and weighing 2.5 grams (typical).It is suitable for ...

The prices of PBGA (plastic ball-grid array) substrates rose 10% recently, almost two months earlier than what the market had expected, according to sources at the makers. In addition, production ...

Housed in a 255-contact plastic ball-grid-array package that measures just 25 by 25 mm, the W82M32V-XBX multichip memory module provides up to 2 Mwords by 32 bits of asynchronous ...

Demand for PBGA (plastic ball-grid array) substrate may lag supply by 10-20% in the first quarter, which will place significant pressure on PBGA substrate prices, according to sources at IC ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to ...