Developing energy-efficient software that leverages application-level energy optimization techniques is essential to tackle the pressing technological challenge of energy efficiency on modern ...

We realized low-ohmic, high-speed interconnects to transfer-printed, 20 μm thick electronic chiplets with small (20 μm×20μm) pads. Spray-coated divinylsiloxane-bis-benzocyclobuten (DVS-BCB) ramps were ...