A Ball Grid Array is descended from the pin grid array (PGA): a historic VLSI through-hole packaging technology, featuring a regular array of metal pins underneath the package on a not very ...

However, for many people, ball grid array (BGA) is still intimidating. Have a look at [VoltLog’s] ... Of course, having a good PCB with good registration markings will help too.

If you want to build cool things these days, you’ve probably had to master surface mount electronics. However, for many people, ball grid array (BGA) is still intimidating. Have a look at [Vo… ...

Both series are packaged as 2020 case size Land Grid Arrays, which feature a low profile, improved heat dissipation, excellent solderability, and a CTE that matches most common circuit board ...

This study quantifies the benefits of WLFO versus flip-chip land grid array (FCLGA) packaging for a radio frequency (RF) MEMS digital tunable capacitor array integrated with 180nm CMOS technology. RF ...

If there’s a need to provide a large number of I/O pins, you could use a land-grid-array (LGA) packaging technique with a rectangular grid of contacts on the underside of the module (Fig. 2).

Actel Corporation is a supplier of innovative programmable logic solutions, including field-programmable gate arrays (FPGAs) based on antifuse and flash technologies, high-performance intellectual ...