NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

Mitsubishi Electric Corporation announced today that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30 A rated current for use in inverter systems of home appliances, will ...

For those written in the last week, our most popular stories on the site cover Sondrel working on a high-performance computing (HPC) chip project, Intel’s Chips Act funding being reduced, the ...

Orbic North America and GCT Semiconductor Sign LOI to Develop and Supply Orbic-Branded FWA Gateway and Mobile Hotspot with GCT's Verizon-Certified 5G Module PR Newswire HAUPPAUGE, N.Y. and SAN ...

KISTA, Sweden, June 10, 2025 /PRNewswire/ -- Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced it has received a purchase order from ...

Murata’s ultra-small Type 2NR multi-protocol wireless module delivers advanced performance, long battery life, and simplified design.

The vehicle AP module showcased by LG Innotek has a compact size as its greatest strength. More than 400 components, including an integrated chip set (SoC), memory semiconductors, and power ...

KISTA, Sweden, June 10, 2025 /PRNewswire/ -- Sivers Semiconductors AB (STO: SIVE), a global leader in photonics and wireless technologies, today announced it has received a purchase order from ...

India raises semiconductor and solar module incentive. Jingyue Hsiao, DIGITIMES Asia, Taipei Thursday 22 September 2022 0. Credit: ...