News
Alpha and Omega Semiconductor Announces Expanded Surface Mount and Module Package Options for its 1200V αSiC MOSFETs Business Wire Thu, Jun 6, 2024, 5:00 AM 5 min read ...
These AC modules integrate Seoul Semiconductor’s patented Acrich AC driver technology with the company’s advanced LEDs, enabling the design of compact light fixtures with superior lighting ...
Alpha and Omega Semiconductor Unveils Its Mega IPM-7 Series Intelligent Power Modules ... and durable design that is ideal ... product design, and advanced packaging know-how to develop high ...
“Using Cadence Virtuoso Studio, the latest custom IC design solution, and the Cadence Clarity 3D Solver together, we have demonstrated a more comprehensive chip-to-package design environment for ...
Fig. 1: M.2 Module PowerPoint cross section. Throughout my internship, I utilized Dassault Systèmes’ SOLIDWORKS computer-aided design (CAD) software to draw substrates, dielectrics, solder masks, vias ...
Hosted on MSN7mon
Valeo, ROHM Semiconductor to develop power modules for EV invertersAs part of the collaboration, ROHM will supply its Silicon Carbide (SiC) 2-in-1 molded module, TRCDRIVE pack, to Valeo for integration into upcoming powertrain systems.
In the next few years, semiconductor suppliers will play a more pivotal role in the future of power. This role definition is driven by a number of factors.
2.5D: 2.5D packaging methodology uses an interposer for stacked inter-chiplet communication, leading to a higher communication rate. It can be paired with stacked memory modules to create high ...
They may request that a given thermal resistance not exceed a particular value and that the package design deliver that performance. (See JEDEC’s JESD51-12, Guidelines for Reporting and Using Package ...
Potential Positives. Announcement of Magillem Packaging positions Arteris, Inc. as an innovator in the semiconductor industry, addressing growing complexities in chip design.
Alpha and Omega Semiconductor Limited a designer, ... power management ICs, and modules, ... product design, and advanced packaging know-how to develop high-performance power management solutions.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results