This FAQ discusses four techniques that work in conjunction: shielded connectors, smart PCB layout, proper grounding, and ...

Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of ...

Researchers find that drying hydrogels briefly turns them into strong, reversible adhesives, opening new uses in robotics and ...

Now, Northeastern researchers have developed a new, lightweight plastic-ceramic composite that conducts heat and can be used ...

CEA-Leti has developed an innovative superconducting interconnect brick that could enable achieving a higher density of ...

Sensata's new High Efficiency Contactor tackles EV charging challenges with seamless 400V/800V switching and top-tier safety.

The potential for these kinds of machines to reshape computer processing, increase energy efficiency, and revolutionize ...

Renesas’ RA8P1 AI MCU combines Arm Cortex-M85 and M33 cores with the Ethos-U55 NPU, delivering AI performance up to 256 GOPs.

Researchers have developed a material that has never existed before: a stable alloy of carbon, silicon, germanium, and tin. What makes this material special is that all four elements, like silicon, ...