That’s what led to the development of Pin Grid Array (PGA) and Ball Grid Array (BGA) packages, which are still around today. Initially, these used ceramic, but now laminates are more common because ...

A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 μm (five times the radius of solder balls used) of initial misalignment during flip-chip assembly.

Flip chip wire bond is a modern way to connect chips, turning them upside down for better performance. This technology makes ...

With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...

Africa’s pioneering and largest domestic payment cards scheme sees new growth trajectory on the back of strategic partnerships with emerging fintechs and challenger banks in the continent’s largest ...

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