The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 μm (five times the radius of solder balls used) of initial misalignment during flip-chip assembly.

With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...

Africa’s pioneering and largest domestic payment cards scheme sees new growth trajectory on the back of strategic partnerships with emerging fintechs and challenger banks in the continent’s largest ...

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