Jason McMillan, product manager at Tarsus Technologies, says Intel`s Flip-Chip Pin Grid Array package is used on Pentium III processors. Subscribe . Sectors . Companies . About . NEWS .

Thermal interface materials (TIMs) have been widely adopted for improved thermal dissipation in flip chip ball grid array (FCBGA), flip chip lidded ball grid array (FCLGA) and flip chip pin grid array ...