LG Innotek has announced plans to invest 600 billion won ($408 million) into its factory in Gumi, North Gyeongsang, through December 2026. This investment aims to significantly expand its production ...

With the investment made at that time, LG Innotek acquired the Gumi Plant 4, which has a total floor area of 230,000 square ...

Their packaging solutions range from 2.5D & 3D advanced packaging to high-end Flip Chip BGA and cost-effective Quad Flat Pack, tailored to meet diverse application needs. In testing, Faraday has ...

The top level of metalization is then used to connect the I/O circuitry itself to the flip chip pads. The pads are, in turn, connected to the package through a solder ball in much the same way that a ...

We've reviewed code that suggests that Samsung could pack the Exynos 2400e on the Galaxy Z Flip FE, as against the 2500 as ...