The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network (FCN) has ...

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Mechanics of Composite, Hybrid, and Multifunctional Materials, Fracture, Fatigue, Failure and Damage Evolution, Volume 3 of the Proceedings of the 2021 SEM Annual Conference & Exposition on ...

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