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This article explains how to install a heatsink on a CPU with the pin-grid array processor design used by most manufacturers.

Flip chip ball grid array (FC-BGA) packages are preferred in high-performance computing and advanced packages because of their superior signal integrity, high input/output density, good thermal ...

With the fast growth in semiconductor industry, packaging solutions of processor units and application specific integrated circuit (ASIC) devices to meet the needs of advanced Silicon (Si) nodes, ...