Broadcom Inc. today debuted two new chips, the Sian3 and Sian2M, that data center operators can use to power their optical networks.Optical networks are often used to link together the servers in ...

Broadcom Inc. today debuted a new chip, the Sian2, for powering the high-speed optical networks that underpin artificial intelligence clusters.The company says that the module provides twice the b ...

Something called 'Baltra' expected to make its debut in 2026, perhaps with tech both already use Apple is reportedly working ...

Sian3: State-of-the-art 3nm DSP PHY delivers industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers over SMF Sian2M: Industry’s first 200G/lane ...

Broadcom (AVGO) advances in co-packaged optics technology with 200G/lane capability, highlighting key improvements in OSAT processes, thermal designs, and fiber routing.

The Sian family of products, which includes Sian and Sian2, is optimized for 800G and 1.6T optical module platforms. Vijay Janapaty, vice president and general manager of the Physical Layer Products ...

Broadcom’s DSPs are optimised for 800G and 1.6T optical module platforms and deliver improved levels of performance by doubling the bandwidth with lower power, ... “The Sian family of products ...

Broadcom also showcased the industry’s first demonstrations of 400G EML technology and PCIe Gen6 optical connectivity, as well as a 400G PCIe Ethernet NIC connecting with an LPO module for ...

Apple is working with semiconductor company Broadcom on its first server chip designed to handle AI applications, according to The Information, which cited three people with knowledge of the project.

PALO ALTO, Calif. - Broadcom Inc. (NASDAQ: NASDAQ:AVGO) announced today the general availability of its Sian™2, a 200 Gbps per lane (200G/lane) PAM-4 DSP PHY, designed to enhance data center ...