Toshiba Rolling Out Complete Bluetooth System Solution for North American Customer Base. SAN JOSE, Calif., December 09, 2002 -- Toshiba America Electronic Components, Inc. (TAEC) today announced a new ...

TSMC said the 0.18-micron mixed-signal CMOS device integrates radio-frequency (RF) circuits with analog and digital baseband functions on a single chip. Zeevo--founded in 1999 and formerly called ...

Toshiba Electronics Europe’s latest Bluetooth IC supports Bluetooth Low Energy (BLE), part of the Bluetooth v4.0 standard. The TC35667FTG adopts an original low-power circuit design and ...

A new single-chip Bluetooth LSI, designated the TC35654, integrates both RF and baseband circuits The chip employs a 0.18 µm CMOS process technology for the RF circuit instead of the usual ...