Waste management is one of the primary problem that the world faces irrespective of the case of developed or developing country. The key issue in the waste management is that the garbage bin at public ...

In this letter, a ridge gap waveguide (RGW) layer transition is proposed for compact 3-D packaging application. The RGW layer transition can increase the layout space in the vertical direction of the ...

Market Overview The Global Modular Packaging Equipment Market size is expected to be worth around USD 25.5 Billion by 2034, from USD 15.2 Billion in 2024, growing at a CAGR of 5.3% during the forecast ...

[Desktop] [Packaging] Native dependencies of uncommon os-arch should be trimmed by default on generic builds #20912 ...

arduino microcontroller bootloader arduino-uno ch340g ch340 ttl-serial serial-debugging embedded-diagnostics hardware-debugging Updated 1 hour ago C++ ...

The latest stories from our Planet or Plastic? series—a multiyear effort to raise awareness about the global plastic waste crisis.