The applications have, in turn, motivated a progression from traditional helical to recent miniaturized printed circuit board implementation, in order to improve the overall power density.

From June 23 to June 27, middle and high school students from across the region participated in a weeklong youth robotics ...

EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This ...