This paper gives an overview of the 3-μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and ...

Vertical interconnects used in monolithic 3-D integrated circuits (3-D ICs), so-called monolithic interlayer vias (MIVs), are as small as local vias. Thus, redesigning an existing 2-D IC layout in a ...