Over the past years, computer scientists have introduced increasingly sophisticated generative AI models that can produce ...

3D main memory is an emerging technology that stacks DRAM dies underneath the processor die using through-silicon vias (TSVs). Prior studies assumed that such technology would decrease main memory ...

In this work, we proposed a new 3D integration technology: the Flip 3D integration (F3D), consisting of the 3D transistor stacking, the 3D dual-sided interconnects, the 3D die-to-die stacking and the ...