News

The Architect’s Newspaper3d
Paper Visions
Intersecting Worlds, Ryan Scavnicky connects virtual architecture to paper architecture and articulates why shared digital ...
IEEE2d
4-Layer Wafer on Wafer Stacking Demonstration with Face to Face/Face to Back Stacked Flexibility Using Hybrid Bond/TSV-Middle for Various 3D Integration - IEEE Xplore
Different from Chip on Wafer stacking technology, Wafer on Wafer (WoW) stacking can provide a tighter pitch and higher interconnect density with higher through-put. The difficulty for WoW stacking is ...
Semiconductor Engineering3d
Novel Assembly Approaches For 3D Device Stacks
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged ...
Dezeen on MSN2d
Park + Associates designs Singapore's "first multi-storey 3D-printed house"
Local architecture studio Park + Associates has completed QR3D, a 3D-printed house in Singapore, which was made from layered ...
IEEE14h
A Layer-Multiplexed 3D On-Chip Network Architecture
Abstract: Programmable many-core processors are poised to become a major design option for many embedded applications. In the design of power-efficient embedded many-core processors, the architecture ...
C&EN4d
Amine-Controlled Assembly of Metal−Sulfite Architecture from 1D Chains to 3D Framework | Inorganic Chemistry - ACS Publications
Whereas open-framework materials have been made in a variety of chemical compositions, few are known in which 3-connected SO 32- anions serve as basic building units. Here, we report four new ...