TSMC certifies CoWoS ® and InFO design flows based on the Synopsys 3 DIC Compiler unified platform 3 DIC Compiler accelerates advanced packaging design productivity Integrated with Ansys' chip ...

AMD has been granted a patent (12080632) that covers glass core substrate tech. Glass substrates will replace traditional organic substrates for multi-chiplet processors in the coming years. The ...

To meet the high-bandwidth requirements of the Fan-Out Chip-on-Substrate (FOCoS) technology platform, additional layers are required. However, as the number of fanout layers increases, significant ...

But these cost-effective methods can cause significant performance degradation with intensified coupling effects due to substrate noise. The paper illustrates a case of a chip failure due to coupling ...

The Synopsys 3DIC Compiler solution provides a unified chip-package co-design and analysis environment for creating an optimal 2.5D/3D multi-die system in a package. The solution includes features ...