Modified semi-additive ... process (mSAP). Commonly used today in IC substrate production, mSAP is poised for widespread adoption in the advanced HDI PCB manufacturing industry. Current line/space ...

And while those never quite went away, they never gained the prominence we all expected alongside the more traditional laminated, subtractive-etched PCBs. Today, emerging technologies are bringing a ...

Umberto Belotti, CEO at Belotti explains: “This partnership is a great opportunity for the development of our companies both ... and confidence” CEAD and Belotti making large-scale additive and ...