This study quantifies the benefits of WLFO versus flip-chip land grid array (FCLGA) packaging for a radio frequency ... packaged parts was conducted on printed circuit boards (PCB); the primary figure ...

The other characteristics are the same so the parts are drop-in alternative to each other and can be used interchangeably on the same printed circuit board (PCB) footprint.

However, for many people, ball grid array (BGA) is still intimidating ... Of course, having a good PCB with good registration markings will help too.

announced it has expanded its package selection to include a Land Grid Array (LGA) option for its RTAX-S field-programmable gate array (FPGA) family. With this package, military and aerospace ...

SP5, like its predecessor SP3, is a 6,096-pin land-grid array (LGA) connector ... According to the PCB schematics, each of the four segments of the SP5 socket is linked to one of the 12 DIMMs ...

Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA ...