AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions.

Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI ...

CT Group organizes a series of key events leading up to its 33rd Anniversary (June 29, 1992 – June 29, 2025) and concludes ...

Designed for high power density in DC-DC applications, the AONK40202 provides features that meet the requirements of AI ...

Advanced semiconductor packaging plays a crucial role in ... and FO-Bridge technology will become widely adopted. For example, the packaging design for memory stacked on ASICs ... sensors, wireless ...

Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new ...

SAN JOSE, Calif. and GUANGZHOU, China -- August 12, 2020-- GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, obtains certification for their GW1NRF-4 µSoC FPGA BLE ...

NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.

According to a report published in Economic Daily News, TSMC has successfully integrated CPO with advanced semiconductor packaging technologies, and sample deliveries are expected in early 2025. Next, ...

Tower Semiconductor and Innolight have announced an expanded collaboration focused on high-volume production of optical modules utilizing Tower's new Silicon Photonics (SiPho) technology.