1: 3D-IC device on a PCB. It would be a mischaracterization to dismiss the interposer ... For an EDA offering to be capable of rising to the occasion, it must meet the following criteria: Model the ...

the accurate 3D packaging thermal model can be exported for inclusion in detailed PCB and full-system thermal analysis. This enables final tuning of the system enclosure and allows natural and/or ...

Recently developed 2.5 and 3D-IC silicon-based packaging technologies have advanced ... Having platforms that cover multiple workflows like IC or package/PCB/system that cater to the appropriate ...

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

The new tool is built around a virtual die model concept which is used to provide IC-to-package design optimisation to reduce package substrate and PCB costs by reducing PCB ... which provides Maxwell ...

†The next level of chip integration is rapidly evolving, and 3D IC technology is poised to enable the next frontier of IC capabilities for customers under various deployment models.†said Shim Il ...