Before considering a structured MEMS-plus-IC design flow, let’s review the traditional MEMS design flow and its shortcomings. While leading MEMS manufacturers have standardized their processes for ...

Figure 3: PowerVia utility automated via insertion flow can increase design reliability and reduce IR drop. Results. The PowerVia utility was used by IC design companies on a variety of production ...

Accurate thermal analysis, performed throughout the design flow from early 3D floorplanning to final chip signoff, is crucial for capturing die-die and die-package thermal hotspots that can affect ...

Semiconductor processing is notoriously challenging. It is one of the most intricate feats of modern engineering due to the ...

The design process involves various things to consider, including a lot of adjustments and optimizations and a few iterative tasks. In this blog, we will explore the stages of the analog IC design ...

Results from a customer’s 7nm low power design demonstrate the effectiveness of the PowerFirst methodology, as shown in table 1. Activity-driven methodology reduces dynamic power. Aprisa’s core ...

Cadence Design Systems' analog and mixed-signal (AMS) IC design flow has been certified for United Microelectronics' (UMC) 22ULP/ULL process technologies, according to the companies. This flow ...

Cadence is expanding its design IP portfolio to meet the demands of the AI training market, delivering TSMC 9000-certified IP for 3D-IC design, including HBM3E 9.6G in N5/N4P and pre-silicon HBM3E ...

Rapidus will collaborate with Siemens to jointly develop a process design kit based on the Calibre platform, the industry-standard verification solution ...

Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC ...