And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

LG Innotek has begun the mass production of flip chip ball grid array (FC-BGA), its new semiconductor ... The new semiconductor packaging is being manufactured at the company’s plant in Gumi ...

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...

Advancements in Semiconductor Technology: Higher integration of chips and complex circuitry necessitates advanced packaging solutions like BGA. Increased Adoption in Consumer Electronics ...