And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

LG Innotek will invest 600 billion won ($408 million) into its factory in Gumi, North Gyeongsang, through December 2026.

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Although named after the semiconductor packaging technique we are familiar with today, DEC Flip-Chips were introduced in 1964 as a modular electronics packaging system. These were used in many of ...

Amkor Technology, Inc.’s AMKR share price has dipped by 14.95%, which has investors questioning if this is right time to buy.