LG Innotek will invest 600 billion won ($408 million) into its factory in Gumi, North Gyeongsang, through December 2026.

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

With the investment made at that time, LG Innotek acquired the Gumi Plant 4, which has a total floor area of 230,000 square ...