And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...

Their packaging solutions range from 2.5D & 3D advanced packaging to high-end Flip Chip BGA and cost-effective Quad Flat Pack, tailored to meet diverse application needs. In testing, Faraday has ...

Advanced packaging, substrate woes Demand is also robust for many advanced package types, especially flip-chip ball grid array (BGA) and flip-chip chip-scale packages (CSPs). The volumes are also ...