The Air Force also awarded a $1.8 million contract to Teledyne Brown Engineering of Huntsville, Alabama, to assemble ECP-Lite, a sensor developed by the Aerospace Corp. “ECP-Lite is a low size ...

AT&S’ advanced ECP technology for microelectronic component packaging leverages embedded bare die and discrete passives into the core of a PCB, reducing the package form factor by 30-50% for ...