IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM. Brooke Crothers writes about mobile computer ...

Memory innovation for AI is accelerating rapidly, but power demands are skyrocketing, raising serious sustainability and infrastructure concerns.

SK Hynix has established a one-team strategy including cooperation with TSMC on development related to HBM4, the sixth-generation HBM (High Bandwidth Memory). SK Hynix will stack HBM4 directly on ...

Next generation memory is starting today with planning and architectural design. Lam is simulating DRAM’s untested future by creating proposals for what 3D DRAM architecture could look like. They are ...

Memory serves as a hard limit on AI model parameter size, and more memory makes room for running larger local AI models. An NVIDIA diagram of the Project DIGITS computer, designed to run AI models.

Computer RAM gets biggest upgrade in 25 years but it may be too little, too late — LPCAMM2 won't stop Apple, Intel and AMD from integrating memory directly on the CPU News By Wayne Williams ...

Universal computer memory that's both super-fast and energy efficient is one step closer to reality after scientists built an "extremely" stable prototype using a completely new material.

The new "Hardware-enforced Stack Protection" feature is under development and an early preview is available in Windows 10 Insider previews builds (fast ring).

Virtual memory with paging lets a computer run many programs at the same time, almost regardless of available RAM. This benefit, called multiprogramming, is a key feature of modern PC operating ...