Memory innovation for AI is accelerating rapidly, but power demands are skyrocketing, raising serious sustainability and infrastructure concerns.

SK Hynix has established a one-team strategy including cooperation with TSMC on development related to HBM4, the sixth-generation HBM (High Bandwidth Memory). SK Hynix will stack HBM4 directly on ...

Next generation memory is starting today with planning and architectural design. Lam is simulating DRAM’s untested future by creating proposals for what 3D DRAM architecture could look like. They are ...

Key technologies like 3D stack memory and advanced platforms such as CBA DRAM, 3D SoC, and 3D NAND are pivotal in meeting modern electronics' performance, power, and miniaturization needs.

Memory serves as a hard limit on AI model parameter size, and more memory makes room for running larger local AI models. An NVIDIA diagram of the Project DIGITS computer, designed to run AI models.

Universal computer memory that's both super-fast and energy efficient is one step closer to reality after scientists built an "extremely" stable prototype using a completely new material.