You don’t need much – the most exotic tool is a BGA rework station, holding the mainboard steady&stiff and heating a specific large chip on the board with an infrared lamp from above.

The temperature is controlled via USB by a computer, allowing [Edmar] to set a temperature profile as recommended by the BGA chip’s data sheet. Right now, removing a BGA chip works great ...

Flip chip substrates use electroless plating methods such as Organic Solderability Protectant (OSP) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG). For Wirebond BGA substrates, ...