There will be certain limitations at first, however. “The next generation will start to stack 3D on APU (to strengthen CPU and GPU),” the poster added. “The technology and cost are in place ...

Innovative power supply technology for 3D-integrated chips improves energy efficiency and reduces noise, addressing the ...

The Zen 3-based CPU would supposedly offer onboard HBM and a 3D-stacked architecture. We don't know if AMD will bring Milan-X to market in 2021, but the company has now shown off 3D die stacking ...

you're seeing the idea of 3D silicon where we'll have cache on one die. We'll have CPU compute on the stacked die on top of it, and obviously, using EMIB that Foveros, we'll be able to compose ...

Well-covered strategies include using high-quality known-good-die (KGD) testing for dies that will be assembled in a 3D stack. KGD test usually includes all package tests, except the interconnect ...

TSMC already makes a system-on-wafer design for Tesla, but will expand it to 3D-stacked HBM memory with a future CoWoS version. Credit: TSMC As Tom's Hardware notes, System-on-Wafer is essentially ...

Changes in the BIOS manual of the ASUS TRX motherboard have sparked rumors 3D V-Cache capabilities could be coming to new AMD APUs The changes could mark a bold move from AMD AMD appears to be ...