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TechCrunch2y
Figma' for the $1 trillion packaging industry - TechCrunch
The traditional lifecycle of packaging is highly inefficient. The illustrator might take a few days to draw up the design and spend another few days to discuss with their client before they can ...
Design-Reuse7mon
YorChip and Digitho developing breakthrough 2D Chiplet Packaging for Mass Markets
Dec. 05, 2024 – . Advanced Packaging for Mass Markets lowers packaging costs enabling Mass Market deployment. SAN RAMON, CA, UNITED STATES, December 5, 2024 -- YorChip, Inc. and Digitho extend ...
Design-Reuse2mon
Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
Apr. 30, 2025 – . Plano, Texas, USA -- April 29, 2025-- Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product ...
Nanowerk9y
Graphene Flagship announces a new Work Package to design 2D-materials-based biomedical technologies
Posted: Apr 11, 2016: Graphene Flagship announces a new Work Package to design 2D-materials-based biomedical technologies (Nanowerk News) With a budget of €1 billion, the Graphene Flagship represents ...